Job Information
Microsoft Corporation Principal Electrical Engineer in Redmond, Washington
Microsoft Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) is the team behind Microsoft’s expanding Cloud Infrastructure and responsible for powering Microsoft’s “Intelligent Cloud” mission. SCHIE delivers the core infrastructure and foundational technologies for Microsoft's over 200 online businesses including Bing, MSN, Office 365, Xbox Live, Teams, OneDrive, and the Microsoft Azure platform globally with our server and data center infrastructure, security and compliance, operations, globalization, and manageability solutions. Our focus is on smart growth, high efficiency, and delivering a trusted experience to customers and partners worldwide and we are looking for engineers to help achieve that mission.
As Microsoft's cloud business continues to grow the ability to deploy new offerings and hardware infrastructure on time, in high volume with high quality and lowest cost is of paramount importance. To achieve this goal, Silicon Manufacturing and Package Engineering team is instrumental in defining and delivering operational measures of success for hardware manufacturing, improving the planning process, quality, delivery, scale and sustainability related to Microsoft cloud hardware. We are looking for engineers who provide customer focused solutions and insight and industry knowledge to envision and implement future technical solutions that will manage and optimize the Cloud infrastructure.
We are looking for a Principal Electrical Engineer to join the team!
Microsoft’s mission is to empower every person and every organization on the planet to achieve more. As employees we come together with a growth mindset, innovate to empower others, and collaborate to realize our shared goals. Each day we build on our values of respect, integrity, and accountability to create a culture of inclusion where everyone can thrive at work and beyond.
Responsibilities
Design, model, and simulate Power Delivery Solutions (i.e., incl. IP design, voltage regulator, motherboard, CPU package, silicon, and decoupling capacitor solution) for data center processors and corresponding platforms to ensure optimized performance.
Work closely with silicon and platform architects, motherboard and package designers, thermal architects and engineers, and power and performance engineers
Interface and collaborate with other physical design, Design for Test (DFT), Design verification and System on Chip (SoC) integration.
Supervise and optimize layout in latest silicon and packaging technologies.
Develop characterization and test plans and support bring-up, debug activities.
Drive new technologies to innovate analog and mixed signal circuits for advanced silicon nodes to improve performance/power metrics.
Collaborate with cross functional team members.
Embody our Culture (https://www.microsoft.com/en-us/about/corporate-values) and Values (https://careers.microsoft.com/us/en/culture)
Qualifications
Required/Minimum Qualifications:
· 9+ years of related technical engineering experience
o OR Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 6+ years technical engineering experience or internship experience
o OR Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 4+ years technical engineering experience or internship experience
o OR Doctorate degree in Electrical Engineering, Computer Engineering, Computer Science, or related field AND 3+ years technical engineering experience.
7+ years of experience in a role that involves mixed-signal design.
2+ years of experience with compute systems power delivery.
Other Requirements:
Ability to meet Microsoft, customer and/or government security screening requirements are required for this role. These requirements include but are not limited to the following specialized security screenings:
Microsoft Cloud Background Check: This position will be required to pass the Microsoft Cloud Background Check upon hire/transfer and every two years thereafter.
Preferred Qualifications:
Demonstrated experience in design through volume production of modern SOCs
Experience with Foundry Silicon and packaging technologies.
Proficient with the latest mixed-signal design flows and tools.
Experience with Power Delivery or Power Management Circuits
Experience with Design Flow automation and scripting.
Analyze and drive characterization and test data from lab and high-volume testing.
Silicon Engineering IC5 - The typical base pay range for this role across the U.S. is USD $137,600 - $267,000 per year. There is a different range applicable to specific work locations, within the San Francisco Bay area and New York City metropolitan area, and the base pay range for this role in those locations is USD $180,400 - $294,000 per year.
Certain roles may be eligible for benefits and other compensation. Find additional benefits and pay information here: https://careers.microsoft.com/us/en/us-corporate-pay
Microsoft will accept applications for the role until June 27, 2024
Microsoft is an equal opportunity employer. Consistent with applicable law, all qualified applicants will receive consideration for employment without regard to age, ancestry, citizenship, color, family or medical care leave, gender identity or expression, genetic information, immigration status, marital status, medical condition, national origin, physical or mental disability, political affiliation, protected veteran or military status, race, ethnicity, religion, sex (including pregnancy), sexual orientation, or any other characteristic protected by applicable local laws, regulations and ordinances. If you need assistance and/or a reasonable accommodation due to a disability during the application process, read more about requesting accommodations (https://careers.microsoft.com/v2/global/en/accessibility.html) .