FirstBank Jobs

Reference #: 1171329900 Komatsu is an indispensable partner to the construction, mining, forestry, forklift, and industrial machinery markets, maximizing value for customers through innovative solutions. With a diverse line of products supported by our advanced IoT technologies, regional distribution channels, and a global service network, we tap into the power of data and technology to enhance safety and productivity while optimizing performance. Komatsu supports a myriad of markets, including housing, infrastructure, water, pipeline, minerals, automobile, aerospace, electronics and medical, through its many brands and subsidiaries, includingTimberPro, Joy, P&H, Montabert, Modular Mining Systems, Hensley Industries, NTC, and Gigaphoton.

Job Overview

Komatsu is an indispensable partner to the construction, mining, forestry, forklift, and industrial machinery markets, maximizing value for customers through innovative solutions. With a diverse line of products supported by our advanced IoT technologies, regional distribution channels, and a global service network, we tap into the power of data and technology to enhance safety and productivity while optimizing performance. Komatsu supports a myriad of markets, including housing, infrastructure, water, pipeline, minerals, automobile, aerospace, electronics and medical, through its many brands and subsidiaries, includingTimberPro, Joy, P&H, Montabert, Modular Mining Systems, Hensley Industries, NTC, and Gigaphoton.

Key Job Responsibilities

Create, refine designs for electronic hardware enclosure packaging for devices including sensors, control and automation hardware for use in hazardous underground mining environment Responsible for choosing appropriate materials for packaging based on electrical, thermal, and mechanical properties as well as cost-effectiveness and manufacturability Engage with an experienced cross-disciplinary team to formulate and design innovative products Support design reviews with internal teams and suppliers Conduct tests to evaluate performance of electronic enclosure packaging designs, including and validation of hardware prior to their release Work with design team to specify mounting strategies, mechanical keep outs, hole size and spacing, PCB copper weights, connector type and placement, and thermal interfaces to the PCB assembly Perform thermal analysis of electronics and design enclosures with proper thermal management to ensure electronic components operate within safe temperature ranges Perform modal and vibration analyses of electronic assemblies with mechanical/structural components Ensure enclosures comply with industry standards and regulations such as IP ratings for ingress protection, and regulatory requirements In addition to electronics packaging, candidate will be responsible for design of test fixtures Support vibration, shock, and thermal tests of products designed Responsible for development of CAD designs, part drawings and assembly drawings Up to 5% of travel is possible

Qualifications/Requirements

BS in Mechanical or related degree with 10 years industry experience in designing ruggedized electronics enclosure packaging Design electro-mechanical assemblies that comply with requirements for thermal , EMI/EMC, shock and vibration specifications Experience with modeling PCBA with enclosures Experience with 3D CAD tools such as Autodesk Inventor Experience in building prototype enclosures, configuring, maintaining 3D printers Experience designing for CNC machining and sheet metal production, as well as selecting appropriate materials and finishing processes

Additional Information

Komatsu is an Equal Opportunity Workplace and an Affirmative Action Employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or protected veteran status.